Figure 3

DNA degradation kinetics and DNA binding by Copper nanoparticles. (a) Time dependent plasmid degradation (Lane 1- DNA alone, Lane 2- DNA+ 0.2 M Tris, Lane 3-DNA+ 0.2 M Tris + 500 μM CuNPs, Lanes 4 to 14 - DNA + 500 μM CuNPs incubated for 10, 60, 120,180, 240, 300, 360, 420, 480, 540, 600 seconds followed by addition of 0.2 M Tris; (b) Time dependent change in the plasmid forms and (c) Binding of CuNPs with DNA shown by Stern-Volmer plot of DNA-EB in presence of different concentration of CuNPs.