Fig. 3
From: Construction of liquid metal-based soft microfluidic sensors via soft lithography
Electrical tests for the deformation response of LM circuits, showing changes in resistance of the LM line in response to different a twisting angles from 0° to 360°, b bending angles from 0° to 200°, c pressure from 5 to 25 N, d stretching length from 3 to 12 mm, e the cycles-RRV curve of different linewidth LM circuits under different strain levels, f the changes in initial resistance R0 after reusing the mold and refilling LM into the stamps