Table 1 Impact of material property. Reprinted with permission from [43]

Materials bandgap, charge density and carrier mobility

Device performance and packaging requirements

Stability in ambient environment

Packaging, fabrication. e.g. A device passivation step may be necessary to protect the semiconductor material if it is unstable in ambient environments

Stability in the intended measuring condition

Device and signal reliability. e.g. In wet chemical and biological sensing, the material must be stable in the intended solution (e.g., pH, ionic strength)

Light and temperature sensitivity

Packaging and operational condition. e.g. Materials that are sensitive to visible light require much more stringent packaging and/or operation in the dark might be required. This requirement compromises the robustness of the device. High bandgap materials are generally less light and temperature sensitive

Compatible fabrication methods and their compatibility for flexible substrates

Dictates the fabrication route to be taken, how scalable production is, and decisions on the substrate to be used