Fig. 3

(a) Compressive stress–strain curves of PNIPAAm, SOR@LDH-CuS-50/P, SOR@LDH-CuS-100/P, SOR@LDH-CuS-200/P, and SOR@LDH-CuS-500/P, respectively. (b) Elastic modulus of PNIPAAm, SOR@LDH-CuS-50/P, SOR@LDH-CuS-100/P, SOR@LDH-CuS-200/P, and SOR@LDH-CuS-500/P, respectively, determined as strain = 80%. (c) Swelling Ratio of PNIPAAm and SOR@LDH-CuS-100/P. Temperature-dependent rheological curves of (d) PNIPAAm and (e) SOR@LDH-CuS-100/P. (f) Time-dependent rheological analysis of SOR@LDH-CuS-100/P performed at 25 °C and 1% of strain. (g) The flow sweep of SOR@LDH-CuS-100/P at 25 °C. (h) Temperature profiles of SOR@LDH-CuS-100/P under 1064 nm laser irradiation at various power densities (0.05, 0.10, 0.20, 0.25 and 0.50 W cm^− 2). (i) The release behaviors of SOR from SOR@LDH-CuS-100/P with or without NIR irradiation